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Co-fired ceramic
Co-fired ceramic devices are monolithic, ceramic microelectronic devices where the entire ceramic support structure and any conductive, resistive, and dielectric materials are fired in a kiln at the same time. Typical devices include capacitors, inductors, resistors, transformers, and hybrid circuits. The technology is also used for a multi-layer packaging for the electronics industry, such as military electronics, MEMS, microprocessor and RF applications.〔(Microwave 101 Website )〕
Co-fired ceramic devices are made by processing a number of layers independently and assembling them into a device as a final step. This differs from semiconductor device fabrication where layers are processed serially; each new layer being fabricated on top of previous layers.
Co-firing can be divided into low temperature (LTCC) and high temperature (HTCC) applications: low temperature means that the sintering temperature is below , while high temperature is around .〔AMETEK ECP Website http://www.ametek-ecp.com/Products/MicroelectronicPackages/HTCC.aspx〕 Compared to LTCC, HTCC has higher resistance conductive layers.
==History==
Co-fired ceramics were first developed in the late '50s and early '60s to make more robust capacitors. The technology was later expanded in the '60s to include multilayer printed circuit board like structures.
抄文引用元・出典: フリー百科事典『 ウィキペディア（Wikipedia）』
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